JPH0729644Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0729644Y2
JPH0729644Y2 JP5129089U JP5129089U JPH0729644Y2 JP H0729644 Y2 JPH0729644 Y2 JP H0729644Y2 JP 5129089 U JP5129089 U JP 5129089U JP 5129089 U JP5129089 U JP 5129089U JP H0729644 Y2 JPH0729644 Y2 JP H0729644Y2
Authority
JP
Japan
Prior art keywords
connecting lead
spring mechanism
lead portion
lower substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5129089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02142548U (en]
Inventor
友広 鈴木
健二 八村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP5129089U priority Critical patent/JPH0729644Y2/ja
Publication of JPH02142548U publication Critical patent/JPH02142548U/ja
Application granted granted Critical
Publication of JPH0729644Y2 publication Critical patent/JPH0729644Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
JP5129089U 1989-04-28 1989-04-28 半導体装置 Expired - Fee Related JPH0729644Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5129089U JPH0729644Y2 (ja) 1989-04-28 1989-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5129089U JPH0729644Y2 (ja) 1989-04-28 1989-04-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH02142548U JPH02142548U (en]) 1990-12-04
JPH0729644Y2 true JPH0729644Y2 (ja) 1995-07-05

Family

ID=31570596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5129089U Expired - Fee Related JPH0729644Y2 (ja) 1989-04-28 1989-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JPH0729644Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245362A (ja) * 2005-03-04 2006-09-14 Mitsubishi Electric Corp 半導体装置およびこれに用いられる電極端子
JP5561527B2 (ja) * 2010-03-24 2014-07-30 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱

Also Published As

Publication number Publication date
JPH02142548U (en]) 1990-12-04

Similar Documents

Publication Publication Date Title
US6297961B1 (en) Semiconductor module and heat sink used in such module
JPS62113452A (ja) パワ−半導体装置
JPH05259334A (ja) 半導体装置
JPH0729644Y2 (ja) 半導体装置
JP3442349B2 (ja) 端子金具
JPH05291467A (ja) リードフレームおよび半導体装置
KR0169272B1 (ko) 반도체장치
US7193303B2 (en) Supporting frame for surface-mount diode package
US6927094B2 (en) Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires
JP2819825B2 (ja) Ｔａｂ内蔵型半導体装置
JP2005129552A (ja) 回路基板
JPH06132447A (ja) 混成型集積回路装置
JPS5843232Y2 (ja) トランジスタ取付装置
JP2003051562A (ja) 半導体装置
JP2003133681A (ja) 半導体装置取付具および半導体装置取付構造
JPH0631723Y2 (ja) 半導体装置
JPS61128550A (ja) 半導体装置
JPH0745774A (ja) 混成集積回路装置
JP3106350B2 (ja) ソケットコネクタ
KR20020039094A (ko) 반도체 소자 패키징 어셈블리 및 그 제조 방법
JPH10229104A (ja) 半導体装置およびその製造に用いるテープキャリヤ
JP2003007899A (ja) 半導体装置及びその製造方法
JPS602873U (ja) 面実装トランジスタの半田付け構造
JPH041743Y2 (en])
JPS63186448A (ja) 半導体装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees